Development of light-scattering thermal cross-linking package film based on self-assembly for liquid crystal display using light emitting diode

被引:0
作者
Takei, Satoshi [1 ,2 ]
Mochizuki, Kazuhide [1 ]
Kubo, Naoya [1 ]
Yokoyama, Yoshiyuki [3 ]
机构
[1] Toyama Prefectural Univ, Toyama 9390398, Japan
[2] Osaka Univ, Toyonaka, Osaka 5608531, Japan
[3] Toyama Ind Technol Ctr, Toyama 9390866, Japan
来源
MICRO-OPTICS 2012 | 2012年 / 8428卷
基金
日本科学技术振兴机构;
关键词
light-scattering film; nano structured pattern; self-assembly; thermal cross-link material; liquid crystal display; light emitting diode;
D O I
10.1117/12.924633
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present investigations of light-scattering thermal cross-link package film based on self-assembly for liquid crystal display using light emitting diode. Thermal cross-link package films based on self-assembly indicated good nano regularly-structured patterning for light-scattering, excellent environmental stability of optical parameters, and solvent intermixing resistance after thermal cross-link reaction. The developed light-scattering thermal cross-link package film-s based on self-assembly is one of the most promising processes ready to be incorporated into the mass production of patterning light-scattering optical layer for advanced liquid crystal display, organic electroluminescent display, and solar cell devices.
引用
收藏
页数:9
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