Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics

被引：28

作者：

Philippi, Bastian ^{[1
]}

Matoy, Kurt ^{[2
]}

Zechner, Johannes ^{[3
]}

Kirchlechner, Christoph ^{[1
,4
]}

Dehm, Gerhard ^{[1
]}

机构：

[1] Max Planck Inst Eisenforsch GmbH, Max Planck Str 1, D-40237 Dusseldorf, Germany

[2] Infineon Technol Austria AG, Siemensstr 2, A-9500 Villach, Austria

[3] Kompetenzzentrum Automobil & Ind Elekt GmbH, Europastr 8, A-9524 Villach, Austria

[4] Univ Leoben, Dept Mat Phys, Franz Josef Str 18, A-8700 Leoben, Austria

来源：

SCRIPTA MATERIALIA | 2016年 / 123卷

关键词：

Lead-free solder; Cu6Sn5; Small-scale testing; Fracture toughness; PB-FREE SOLDERS; MECHANICAL-BEHAVIOR; JOINTS; COATINGS;

D O I：

10.1016/j.scriptamat.2016.05.039

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Even though lead-free Sn-Ag-Cu based solder alloys are emerging as promising candidates to replace well-established but hazardous lead-containing solders, they suffer from limited knowledge about their mechanical performance. To ensure the high reliability demands in microelectronics, fracture properties need to be quantified with respect to crucial microstructural elements like Cu6Sn5 intermetallic compounds formed at common Cu metallization interfaces. While indentation fracture testing methods have shown varying fracture toughness values, micro-cantilever fracture testing is applied in this work on FIB-prepared single-crystalline Cu6Sn5 cantilevers to clarify on the microstructure-fracture relationship. (C) 2016 Elsevier Ltd. All rights reserved.

引用

页码：38 / 41

页数：4

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