Integrated diffusion-recombination model for describing the logarithmic time dependence of plasma damage in porous low-k materials

被引:13
作者
Kunnen, E. [1 ]
Barkema, G. T. [2 ]
Maes, C. [3 ]
Shamiryan, D. [1 ]
Urbanowicz, A. [1 ]
Struyf, H. [1 ]
Baklanov, M. R. [1 ]
机构
[1] IMEC, B-3001 Heverlee, Belgium
[2] Univ Utrecht, Inst Theoret Phys, NL-3584 CE Utrecht, Netherlands
[3] Inst Theoret Fys, B-3001 Heverlee, Belgium
关键词
Plasma damage; Recombination; Diffusion; Low-k; Porous;
D O I
10.1016/j.mee.2010.07.014
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work proposes an extended model that describes the propagation of damage in porous low-k material exposed to a plasma. Recent work has indicated that recombination and diffusion play a more dominant role than VUV light [1-5] in oxygen plasma induced damage. Especially at low depths, the radical concentration is determined by the number of radicals that disappear back into the plasma while the final depth of damage is defined by recombination of oxygen atoms. A logarithmic equation has been proposed to describe the behavior as a function of time. In this work this equation is extended to take diffusion into account, next to recombination. The results are in agreement with experimental data and one-dimensional random walk theory calculations. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码:631 / 634
页数:4
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