Comparative Study of Printed Circuit Board Substrates used for Thermal Management of High Power LEDs

被引：0

作者：

Freisleben, Jaroslav ^{[1
]}

Dzugan, Tomas ^{[1
]}

Hamacek, Ales ^{[1
]}

机构：

[1] Univ West Bohemia RICE, Dept Technol & Measurement, Plzen, Czech Republic

来源：

2015 38TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2015) | 2015年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The goal of this study is to compare thermal parameters of different substrates for high power light-emitting diodes (LEDs) with emphasis on the cost and size. The standard glass epoxy substrate (FR4) with thermal vias and insulated metallic substrate (IMS) were chosen as suitable samples for this study. Thermal simulation and thermal start-up were performed in order to evaluate the heat dissipation of high power LED.

引用

页码：80 / 84

页数：5

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