Effect of hot-press treatment on electrochemically deposited antimony telluride film

被引：5
作者：
Qiu, Wujun [1 ]
Yang, Shenghui [1 ]
Zhao, Xinbing [1 ]
机构：
[1] Zhejiang Univ, Dept Mat Sci & Engn, State Key Lab Silicon Mat, Hangzhou 310027, Zhejiang, Peoples R China
来源：
THIN SOLID FILMS | 2011年 / 519卷 / 19期
基金：
中国国家自然科学基金;
关键词：
Thin films; Thermoelectric materials; Electrodeposition; Antimony telluride; Hot-uniaxial-press; THERMOELECTRIC PROPERTIES; BI2TE3; FILMS; BISMUTH; ELECTRODEPOSITION; ALLOYS; FABRICATION; SB2TE3; ECALE;
D O I：
10.1016/j.tsf.2011.04.106
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Antimony telluride thin film electrochemically deposited in a triethanol based alkaline electrolyte features amorphous structure, high electrical resistance, as well as fine morphology, minor impurity incorporation and anti-corrosivity. To further improve film thermoelectric performance, this film was subjected to hot-uniaxial-press (HUP) treatment at 170-250 degrees C. HUP treated films revealed crystallized structures, and exhibited 2-3 orders of magnitude improvement of electrical conductance. The [TeO32-]/[SbO2-] of the deposition electrolyte was utilized to fine tune film composition and thermal electrical performance. Ni diffusion from the substrate into the film was also studied, and it can be reduced by using lower temperature and shorter time of HUP treatment. Film Seebeck coefficient and power factor reached 138 mu V/K and 337 mu W/K-2.m, respectively, at elaborated deposition and HUP conditions. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码：6399 / 6402
页数：4
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