Fabrication of complex circuit on printed circuit board (PCB) using electrochemical micro-machining

被引:10
作者
Singh, Jitendra [1 ]
Jain, V. K. [1 ]
Ramkumar, J. [1 ]
机构
[1] Indian Inst Technol Kanpur, Dept Mech Engn, Kanpur 208016, Uttar Pradesh, India
关键词
Electrochemical micro-machining; Printed circuit board; Micro-machining;
D O I
10.1007/s00170-015-7817-4
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Electrochemical micro-machining (ECMM) is an advanced machining process for machining of electrically conducting materials. In the present work, an experimental set-up for ECMM is used to fabricate complex circuits on a printed circuit board (PCB) by using a masking technique. Mask is made using 50 mu m transparency sheet cut by laser beam. This mask is bonded on a printed circuit board of cross section 35 mm x 35 mm by a water-insoluble glue Araldite (epoxy adhesive). For the analysis of the data, the channel width of the circuit structure is measured with the help of photographs taken by Dino-Lite capture and optical microscope. For this purpose, the whole structure is divided into four regions, which have 58 points in which width has been measured. For the analysis of the depth of a channel, a dial gauge having 1 mu m least count is used to measure the depth at different sections (or regions) as marked in the figure. For this purpose, the whole structure is divided into four regions, which have 27 points. After all the experiments have been completed, the circuit is compared with the main circuit which is fabricated by milling process and percentage error in the circuit is evaluated.
引用
收藏
页码:2073 / 2081
页数:9
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