Experimental Study on Reciprocating Electroplated Diamond Wire Saws Cutting SiC Wafer

The experiment that WXD170-type reciprocating rotating diamond wire saw cuts SiC wafer was studied using orthogonal test method in this paper. The influence of cutting speed of diamond wire saw, work-piece feed speed and rotating speed of work-piece on cutting process were analyzed. The optimized cutting parameters which can improve surface quality of slices and reduce tangential force were obtained. The results show that: the surface quality of slices which was cloud-shaped can be improved significantly due to the increase of the work-piece rotation. The work-piece feed speed and the rotation speed have greater impact on the tangential force than the saw wire speed; the work-piece feed speed and the work-piece rotation speed have greater impact on surface roughness than the saw wire speed. An important way to be obtained the smaller tangential force and better surface quality of slices is considering of a reasonable match among cutting speed of diamond wire saw, work-piece feed speed and rotating speed of work-piece comprehensively.