Microstructures and creep of AM50-Sb-Gd alloys

Creep behavior of AM50-0.4% Sb-0.9%Gd alloy has been studied at temperatures ranging from 150 to 200 degrees C and at stresses ranging from 40 to 90 MPa. Results show that the creep rate of AM50-0.4%Sb-0.9%Gd alloy was mainly controlled by dislocation climb at low stresses under 50 MPa. The activation energy for the creep was 131.2 +/- 10 kJ/mol and the stress exponent was in the range from 4 to 9 depending on the applied stress. More than one defon-nation-mechanism were involved during the creep of this alloy. Microstructures of the alloy consist of alpha-Mg matrix and fine particles, distinguished as Mg17Al12, Sb2M93, and Mg2Gd or Al7GdMn5 that were homogeneously distributed in the matrix of the alloy, which effectively reduced the movement of dislocations, enhancing the creep resistance. Many dislocations were identified to be present on non-basal planes after creep deformation.