Vacuum packaging design and analysis for UFPA

被引：0

作者：

Liu, Dafu ^{[1
]}

Xu, Qinfei ^{[1
]}

机构：

[1] CAS, Shanghai Inst Tech Phys, Key Lab Infrared Imaging Mat & Devices, Shanghai 200083, Peoples R China

来源：

OPTOELECTRONIC DEVICES AND INTEGRATION III | 2010年 / 7847卷

关键词：

UFPA; uncooled; packaging; out-gassing;

D O I：

10.1117/12.868893

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Uncooled focal plane array (UFPA) has broad application prospects in civilian and space because it's cheaper, more compact and high reliability. Many research institutes and companies have carried out the research of uncooled focal plane array. This paper shows a vacuum package design of UFPA, and its architecture will be given. The assembly is an all-metal vacuum package, which has been proven rugged and reliable. Out-gassing, permeation, evaporator, and air leak are factors to reduce the component vacuum lifetime. Theoretical analysis shows that material out-gassing is the main factor of pressure rise inside package. Theoretical analysis and calculation show that designed metallic structure can meet the need of 10-years life.

引用

页数：7