Hybrid integration of III-V semiconductor lasers on silicon waveguides using optofluidic microbubble manipulation

被引:14
作者
Jung, Youngho [1 ]
Shim, Jaeho [1 ]
Kwon, Kyungmook [1 ]
You, Jong-Bum [1 ]
Choi, Kyunghan [1 ]
Yu, Kyoungsik [1 ]
机构
[1] Korea Adv Inst Sci & Technol, Sch Elect Engn, Daejeon 34141, South Korea
来源
SCIENTIFIC REPORTS | 2016年 / 6卷
基金
英国工程与自然科学研究理事会;
关键词
D O I
10.1038/srep29841
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
Optofluidic manipulation mechanisms have been successfully applied to micro/nano-scale assembly and handling applications in biophysics, electronics, and photonics. Here, we extend the laser-based optofluidic microbubble manipulation technique to achieve hybrid integration of compound semiconductor microdisk lasers on the silicon photonic circuit platform. The microscale compound semiconductor block trapped on the microbubble surface can be precisely assembled on a desired position using photothermocapillary convective flows induced by focused laser beam illumination. Strong light absorption within the micro-scale compound semiconductor object allows real-time and on-demand microbubble generation. After the assembly process, we verify that electromagnetic radiation from the optically-pumped InGaAsP microdisk laser can be efficiently coupled to the single-mode silicon waveguide through vertical evanescent coupling. Our simple and accurate microbubble-based manipulation technique may provide a new pathway for realizing high precision fluidic assembly schemes for heterogeneously integrated photonic/electronic platforms as well as microelectromechanical systems.
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页数:7
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