Quantitative thermal measurement by the use of scanning thermal microscope and resistive thermal probes

被引:18
作者
Bodzenta, Jerzy [1 ]
Kazmierczak-Balata, Anna [1 ]
Harris, Kurt [2 ]
机构
[1] Silesian Tech Univ, Inst Phys, Konarskiego 22B, PL-44100 Gliwice, Poland
[2] Flibe Energy Inc, 7800 Madison Blvd, Huntsville, AL 35806 USA
关键词
PROPERTY IMAGING TECHNIQUE; HEAT-TRANSFER; THIN-FILMS; 2-OMEGA METHOD; CONDUCTIVITY; THERMOMETRY; CANTILEVER; RESISTANCE; TRANSPORT; SILICON;
D O I
10.1063/1.5125062
中图分类号
O59 [应用物理学];
学科分类号
摘要
Scanning thermal microscopy (SThM) is the only method for thermal measurements providing spatial resolution in the nanometer range. The method combines the topographical imaging of atomic force microscopy (AFM) with the thermal characterization of samples by the use of specially designed AFM probes having a temperature sensor near the apex. Measurements can be carried out in two modes: the temperature contrast (or passive) mode and the conductance contrast (or active) mode. In the first mode, the probe is not heated and the temperature distribution on the sample surface is measured. In the second mode, there are no heat sources in the sample and the probe is heated. The probe temperature depends on the thermal conductance for the heat exchange between the probe and the sample. This thermal conductance depends on the sample thermal conductivity and probe-sample interfacial thermal resistance. If the latter is constant, the distribution of the thermal conductivity on the sample surface can be obtained. The principle of qualitative SThM is quite simple. However, quantitative measurements require rigorous analysis of temperature distribution and heat fluxes in the probe-sample system. This paper provides basic information about SThM starting from first principles, through instrumentation, characterization of probes used for measurements, general theory of the temperature, and the thermal conductivity measurements, to a few examples of practical applications of this method. Finally, perspectives and challenges for SThM based measurements are discussed. Published under license by AIP Publishing.
引用
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页数:20
相关论文
共 116 条
[71]   Scanning thermal microscopy using batch fabricated thermocouple probes [J].
Mills, G ;
Zhou, H ;
Midha, A ;
Donaldson, L ;
Weaver, JMR .
APPLIED PHYSICS LETTERS, 1998, 72 (22) :2900-2902
[72]   Beating the amorphous limit in thermal conductivity by superlattices design [J].
Mizuno, Hideyuki ;
Mossa, Stefano ;
Barrat, Jean-Louis .
SCIENTIFIC REPORTS, 2015, 5
[73]   Emerging challenges and materials for thermal management of electronics [J].
Moore, Arden L. ;
Shi, Li .
MATERIALS TODAY, 2014, 17 (04) :163-174
[74]   SCANNING THERMAL IMAGING MICROSCOPY USING COMPOSITE CANTILEVER PROBES [J].
NAKABEPPU, O ;
CHANDRACHOOD, M ;
WU, Y ;
LAI, J ;
MAJUMDAR, A .
APPLIED PHYSICS LETTERS, 1995, 66 (06) :694-696
[75]   Measuring material softening with nanoscale spatial resolution using heated silicon probes [J].
Nelson, B. A. ;
King, W. P. .
REVIEW OF SCIENTIFIC INSTRUMENTS, 2007, 78 (02)
[76]   SCANNING PROBE MICROSCOPY OF THERMAL-CONDUCTIVITY AND SUBSURFACE PROPERTIES [J].
NONNENMACHER, M ;
WICKRAMASINGHE, HK .
APPLIED PHYSICS LETTERS, 1992, 61 (02) :168-170
[77]   Thermal imaging of thin films by scanning thermal microscope [J].
Oesterschulze, E ;
Stopka, M ;
Ackermann, L ;
Scholz, W ;
Werner, S .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1996, 14 (02) :832-837
[78]   TRANSIENT THERMOREFLECTANCE FROM THIN METAL-FILMS [J].
PADDOCK, CA ;
EESLEY, GL .
JOURNAL OF APPLIED PHYSICS, 1986, 60 (01) :285-290
[79]   Nano-Localized Thermal Analysis and Mapping of Surface and Sub-Surface Thermal Properties Using Scanning Thermal Microscopy (SThM) [J].
Pereira, Maria J. ;
Amaral, Joao S. ;
Silva, Nuno J. O. ;
Amaral, Vitor S. .
MICROSCOPY AND MICROANALYSIS, 2016, 22 (06) :1270-1280
[80]   Thermoelectric materials and applications for energy harvesting power generation [J].
Petsagkourakis, Ioannis ;
Tybrandt, Klas ;
Crispin, Xavier ;
Ohkubo, Isao ;
Satoh, Norifusa ;
Mori, Takao .
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2018, 19 (01) :836-862