Fabrication of High-Frequency pMUT Arrays on Silicon Substrates

被引：0

作者：

Pedersen, Thomas ^{[1
]}

Zawada, Tomasz ^{[2
]}

Hansen, Karsten ^{[2
]}

Lou-Moeller, Rasmus ^{[2
]}

Thomsen, Erik V. ^{[1
]}

机构：

[1] Tech Univ Denmark, Dept Micro & Nanotechnol, Lyngby, Denmark

[2] Ferroperm Piezoceram AS, Kvistgaard, Denmark

来源：

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL | 2010年 / 57卷 / 06期

关键词：

Piezoelectricity - Ultrasonic transducers - Substrates - Ultrasonic applications - Zirconia - Lead zirconate titanate - Silicon wafers;

D O I：

10.1109/TUFFC.2010.1566

中图分类号：

O42 [声学];

学科分类号：

070206 ; 082403 ;

摘要：

A novel technique based on silicon micromachining for fabrication of linear arrays of high-frequency piezoelectric micromachined ultrasound transducers (pMUT) is presented. Piezoelectric elements are formed by deposition of lead zirconia titanate into etched features of a silicon substrate such that the depth of these features determine the element thickness and hence the resonance frequency. The process leaves a near planar surface which is ideal for further wafer level processing such as top electrode and interconnect formation. A fabricated element is characterized by pulse echo response.

引用

页码：1470 / 1477

页数：8

共 14 条

[1]

Cannata JM, 2004, ULTRASON, P894

[2] Micromachining of a piezocomposite transducer using a copper vapor laser [J].

Farlow, N ;

Galbraith, W ;

Kowles, M ;

Hayward, G .

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 2001, 48 (03) :639-640

[3] Investigation of Top/Bottom Electrode and Diffusion Barrier Layer for PZT Thick Film MEMS Sensors [J].

Hindrichsen, C. C. ;

Pedersen, T. ;

Thomsen, E. V. ;

Hansen, K. ;

Lou-Moller, R. .

FERROELECTRICS, 2008, 367 :201-213

[4] Interdigital pair bonding for high frequency (20-50 MHz) ultrasonic composite transducers [J].

Liu, RB ;

Harasiewicz, KA ;

Foster, FS .

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 2001, 48 (01) :299-306

[5]

Liu RB, 1999, ULTRASON, P973, DOI 10.1109/ULTSYM.1999.849151

[6] FABRICATION OF HIGH-FREQUENCY SPHERICALLY SHAPED CERAMIC TRANSDUCERS [J].

LOCKWOOD, GR ;

TURNBULL, DH ;

FOSTER, FS .

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 1994, 41 (02) :231-235

[7] Screen-printed piezoceramic thick films for miniaturised devices [J].

Lou-Moeller, R. ;

Hindrichsen, C. C. ;

Thamdrup, L. H. ;

Bove, T. ;

Ringgaard, E. ;

Pedersen, A. F. ;

Thomsen, E. V. .

JOURNAL OF ELECTROCERAMICS, 2007, 19 (04) :333-338

[8] Performance and characterization of new micromachined high-frequency linear arrays [J].

Lukacs, Marc ;

Yin, Jianhua ;

Pang, Guofeng ;

Garcia, Richard C. ;

Cherin, Emmanuel ;

Williams, Ross ;

Mehi, Jim ;

Foster, F. Stuart .

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 2006, 53 (10) :1719-1729

[9]

Michau S, 2004, ULTRASON, P898

[10]

Onoe M., 1963, IEEE Transactions on Ultrasonics Engineering, V10, P32, DOI DOI 10.1109/T-UE.1963.29298

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