Assembly and soldering process in lead-free technology

被引：0

作者：

Sitek, J. ^{[1
]}

Drozd, Z. ^{[2
]}

Bukat, K. ^{[1
]}

机构：

[1] Tele & Radio Res Inst, 11 Ratuszowa St, PL-03450 Warsaw, Poland

[2] Warsaw Univ Technol, Inst Precis & Biomed Engn, Div Precis & Elect Prod Technol, PL-02525 Warsaw, Poland

来源：

RECENT ADVANCES IN MECHATRONICS | 2007年

关键词：

D O I：

10.1007/978-3-540-73956-2_67

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Continuous miniaturization of electronic products & components and parallel increase their functionality in modem applications together with the EU RoHS directive restrictions delivers everlasting technological difficulties. The problems with materials, assembly and soldering equipments selection, printing solder paste both on very small and big PCB pads, optimization of soldering processes for lead-free complex board were shown at the article.

引用

页码：340 / +

页数：2