Band-Pass Filter with Cross Waveguide and High-Temperature Superconductivity E-Plane Insert

This paper provides consideration of a new technical solution of the band-pass filter (BPF). Microwave BPF consists of a cross waveguide with E-plane insert of high-temperature superconductivity (HTS) material. We have found that the insertion loss at contacts between HTS insert and a waveguide body is smaller than the loss in waveguide walls and HTS insert. This feature of the filter simplifies BPF manufacturing. Design procedure includes a calculation of the filter-prototype and a geometry synthesis by a modeling and electrodynamics computing. This filter has lower insertion loss than the filter with copper insert, and also increases reliability of design due to eliminating the causes of destruction of dielectric substrate with HTS material