The effect of anions on the anodic formation of copper sulphide films on copper

被引：12
作者：
Martino, T. [1 ]
Chen, J. [1 ]
Noel, J. J. [1 ,2 ]
Shoesmith, D. W. [1 ,2 ]
机构：
[1] Univ Western Ontario, Dept Chem, London, ON, Canada
[2] Univ Western Ontario, Surface Sci Western, London, ON, Canada
来源：
ELECTROCHIMICA ACTA | 2020年 / 331卷
关键词：
Copper; Corrosion; Cyclic voltammetry; Aqueous sulphide; Anions; IN-SITU STM; SULFATE ADSORPTION; AQUEOUS-SOLUTIONS; CORROSION; CHLORIDE; KINETICS; GROWTH; SILVER; CU(111);
D O I：
10.1016/j.electacta.2019.135319
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The influence of anions (Cl-, SO42-, HCO3-) on the anodic formation of Cu2S films on Cu was investigated using cyclic voltammetry at rotating disk electrodes. At low ionic strengths, film growth was partially or completely controlled by ionic migration within pores in the growing film depending on the sulphide concentration. At low sulphide concentrations and high ionic strengths, film growth was controlled by the rate of anodic formation of Cu-I (as adsorbed Cu(SH)(ads)) at the base of pores in the Cu2S film. The ability of anions to suppress this reaction was in the order SO42- > HCO3- > Cl-. At higher sulphide concentrations, the film porosity was significantly reduced and film growth controlled by the properties of the compact Cu2S film with ionic migration rate-controlling even at high ionic strength. (C) 2019 Published by Elsevier Ltd.
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页数：8
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