Pb-free resistor for Pb-free LTCC system

被引:0
|
作者
Fukaya, M [1 ]
Higuchi, C [1 ]
机构
[1] SMIED Ogaki Ceram Inc, Gifu 5030034, Japan
来源
2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS | 2000年 / 4339卷
关键词
Pb-free; LTCC; low thermal expansion resistor; SiO2-B2O3-K2O glass; and 850 degrees C firing;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
There exist various stresses generated by the affects of the internal wiring in LTCC (Multi Layered Low Temperature Firable Ceramic Circuit Board). Because of these stresses, thick film resistor formed on the surface layer drifts after resistor trimming and this is an obstruction for the high density design. Authors performed the FEM (Finite Element Method) for the analysis of the stress and found that significantly lower thermal coefficient of expansion (TCE) of resistor than LTCC is effective to the resistance drifts. Based on the analysis results, highly reliable Pb-free low thermal expansion resistor for high density LTCC was developed. Using low thermal expansion of SiO2-B2O3-K2O as main glass, the wettability with glass is secured by coated K2O on the conductive material of RuO2. It was successfully achieved to satisfy both low thermal expansion and electric properties. The developed resistor is fired in the same temperature as the conventional resistors at 850 degreesC. The highly reliable Pb-free LTCC system is established by using this resistor.
引用
收藏
页码:636 / 641
页数:6
相关论文
共 50 条
  • [1] There's more to Pb-free production than just a Pb-free product
    IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, 2006, : 149 - 149
  • [2] Wetting characteristics of Pb-free solder pastes and Pb-free PWB finishes
    Sattiraju, SV
    Dang, B
    Johnson, RW
    Li, Y
    Smith, JS
    Bozack, MJ
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1338 - 1344
  • [3] A total Pb-free solution
    Circ Assem, 2006, 8 (17):
  • [4] Implementing Pb-free soldering
    Anderson, Iver E.
    Kirkland, Kenneth
    Willenberg, Wayne
    Surface mount technology, 2000, 14 (11): : 78 - 81
  • [5] Pb-free surface-finishing on electronic components' terminals for Pb-free soldering assembly
    Tanaka, H
    Tanimoto, M
    Matsuda, A
    Uno, T
    Kurihara, M
    Shiga, S
    JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) : 1216 - 1223
  • [6] Preparing for the Pb-free generation
    Anon
    Electronic Packaging and Production, 2001, 41 (08):
  • [7] Electromigration in Pb-free Solders
    Lu, Minhua
    Shih, Da-Yuan
    Lauro, Paul
    2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 956 - 963
  • [8] Pb-free defects and mitigation : Common problems of Pb-free soldering, and how to solve them
    Vitronics Soltec BV
    Circ Assem, 2006, 2 (86):
  • [9] Pb-free surface-finishing on electronic components’ terminals for Pb-free soldering assembly
    Hitoshi Tanaka
    Morimasa Tanimoto
    Akira Matsuda
    Takeo Uno
    Masaaki Kurihara
    Shoji Shiga
    Journal of Electronic Materials, 1999, 28 : 1216 - 1223
  • [10] Advanced Characterization of Pb-Free Interconnects
    Richard Coyle
    Babak Arfaei
    JOM, 2016, 68 : 2869 - 2870