Mechanical properties of interfacial phases between Sn-3.5 Ag solder and Ni-18 at. % W barrier film by nanoindentation

被引：6

作者：

Chew, C. S. ^{[1
]}

Durairaj, R. ^{[1
]}

Haseeb, A. S. M. A. ^{[2
]}

Beake, B. ^{[3
]}

机构：

[1] Univ Tunku Abdul Rahman, Dept Mech & Mat Engn, Kuala Lumpur, Malaysia

[2] Univ Malaya, Dept Mech Engn, Kuala Lumpur, Malaysia

[3] Micro Mat Ltd, Wrexham, Wales

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 2015年 / 27卷 / 02期

关键词：

Intermetallic compounds; Microstructure; Reflow soldering; Coatings; LEAD-FREE SOLDER; NI3SN4 INTERMETALLIC COMPOUNDS; MULTIPLE REFLOW; P METALLIZATION; THIN-FILMS; CU6SN5; CU3SN; TEMPERATURE; RELIABILITY; HARDNESS;

D O I：

10.1108/SSMT-01-2015-0001

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Purpose - The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. % W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study, mechanical properties of the IMC formed between SA solder and Ni-18 at. % W film after six times reflows were performed by nanoindentation. Design/methodology/approach - The characterization was carried at 25 degrees C, and 100 indents were generated. The elastic modulus and hardness were investigated. Findings - The results showed that hardness of Ni3Sn4 IMC was higher than amorphous Sn-Ni-W phase. A slight bigger indent was observed on the Sn-Ni-W layer compared with that on the Ni3Sn4 IMC. Lower topographical height in the Sn-Ni-W layer indicated that the Sn-Ni-W phase was softer compared with the Ni3Sn4 IMC. The lower hardness and soft Sn-Ni-W phase is significantly related to the amorphous structure that formed through solid-state amorphization. Originality/value - There are no publications about the indentation on the interfacial between the Ni-W layer and the Sn-Ag solder.

引用

页码：90 / 94

页数：5

共 30 条

[1] Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad [J].

Alam, MO ;

Chan, YC ;

Tu, KN .

JOURNAL OF APPLIED PHYSICS, 2003, 94 (06) :4108-4115

[2]

Albrecht H.J., 2003, 5 C EPTC 2003 EL PAC

[3] Theoretical prediction of thermodynamic activities of all components in the Bi-Sb-Sn ternary lead-free solder system and Pb-Bi-Sb-Sn quaternary system [J].

Awe, O. E. ;

Oshakuade, O. M. .

THERMOCHIMICA ACTA, 2014, 589 :47-55

[4] Nanocrystalline structure and hardness of thin films [J].

Cavaleiro, A ;

Louro, C .

VACUUM, 2002, 64 (3-4) :211-218

[5] The Sn/Ni-7Wt.%V interfacial reactions [J].

Chen, Chih-Chi ;

Chen, Sinn-Wen .

JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (09) :1701-1707

[6] Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films [J].

Chen, Zhong ;

He, Min ;

Balakrisnan, Bavani ;

Chum, Chan Choy .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 423 (1-2) :107-110

[7]

Chew C.S., 2009, INT C EL PACK TECHN

[8]

Chew C.S., 2012, 35 IEEE CPMT INT EL

[9]

Chew C.S., 2010, 3 INT NAN C INEC HON

[10] Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation [J].

Gao, F. ;

Takemoto, T. .

MATERIALS LETTERS, 2006, 60 (19) :2315-2318

← 1 2 3 →