Piezoelectric film sensor for measurement of peel stresses in bonded joints

被引:2
作者
Shankar, K [1 ]
Tahtali, M [1 ]
Chester, R [1 ]
Torr, G [1 ]
机构
[1] Univ New S Wales, Univ Coll, Australian Def Force Acad, Canberra, ACT 2600, Australia
来源
SECOND INTERNATIONAL CONFERENCE ON EXPERIMENTAL MECHANICS | 2001年 / 4317卷
关键词
D O I
10.1117/12.429603
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Adhesively bonded composite patches employed for repairing fatigue cracks in metallic airframe structural components often fail under peel stresses generated in the structure. The application of piezoelectric stress sensors embedded within the bonded joint for direct measurement of the peel stresses is reported here. Polyvinylidine fluoride (PVDF) film of about 28 micron thickness coated with nickel copper is employed to construct thin sensors embedded between the composite patch and the metallic surface of the crotch joint specimen. PVDF sensors with varying sizes were constructed and calibrated using polycarbonate test specimens subjected to uniaxial tension and compression. The sensors were then embedded between the composite patch and the metallic surface of the crotch specimen to monitor the peel stresses in the adhesive. The measurements are compared with stresses predicted by finite element modelling.
引用
收藏
页码:363 / 368
页数:6
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