Optical tools and techniques for failure analysis of modern integrated circuits

被引:0
作者
Cole, EI [1 ]
Bruce, MR [1 ]
Barton, DL [1 ]
Tangyunyong, P [1 ]
Bruce, VJ [1 ]
Hawkins, CF [1 ]
Soden, JM [1 ]
Henderson, L [1 ]
Ring, RM [1 ]
Chong, WL [1 ]
Eppes, DH [1 ]
Wilcox, J [1 ]
Benson, DA [1 ]
机构
[1] Sandia Natl Labs, Livermore, CA 94550 USA
来源
2003 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2 | 2003年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Defect localization in modem ICs can be extremely challenging. To address this complexity several optically based methodologies have been developed over the past decade. These techniques will be described demonstrating their utility in locating defects.
引用
收藏
页码:537 / 538
页数:2
相关论文
共 8 条
  • [1] BRUCE MR, 2000, INT S TEST FAIL AN, P21
  • [2] Cole E. I. Jr., 2001, ISTFA 2001. Proceedings of the 27th International Symposium for Testing and Failure Analysis, P43
  • [3] Backside localization of open and shorted IC interconnections
    Cole, EI
    Tangyunyong, P
    Barton, DL
    [J]. 1998 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 36TH ANNUAL, 1998, : 129 - 136
  • [4] COLE EI, 1994, 1994 IEEE INTERNATIONAL RELIABILITY PHYSICS PROCEEDINGS - 32ND ANNUAL, P388, DOI 10.1109/RELPHY.1994.307808
  • [5] Hawkins C. F., 1990, ISTFA 1990. International Symposium for Testing and Failure Analysis. The Failure Analysis Forum for Microelectronics and Advanced Materials. Conference Proceedings, P55
  • [6] Kash J. A., 1998, ISTFA, P482
  • [7] Novel optical probing technique for flip chip packaged microprocessors
    Paniccia, M
    Eiles, T
    Rao, VRM
    Yee, WM
    [J]. INTERNATIONAL TEST CONFERENCE 1998, PROCEEDINGS, 1998, : 740 - 747
  • [8] WILLS KS, 1990, ISTFA, P21