Influence of the Position of the Electrical Contact on the Size of the Temperature Distribution

被引：4

作者：

Medved, Dusan ^{[1
]}

Zbojovsky, Jan ^{[1
]}

机构：

[1] Tech Univ Kosice, Masiarska 74, Kosice 04201, Slovakia

来源：

PRZEGLAD ELEKTROTECHNICZNY | 2021年 / 97卷 / 12期

关键词：

temperature field distribution; electrical contact; ANSYS; heat transfer;

D O I：

10.15199/48.2021.12.48

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper deals with the investigation of temperature field distribution around the high-current electric contact. The analyses of temperature field were realised in simulation environment ANSYS and provide better understanding why the electrical contact position influences the heat dissipation. Material of electrical contact was copper, aluminium, brass and non-standard material for power devices, silver. Results were compared and the conclusion with the recommendation were stated in the end of this paper.

引用

页码：230 / 233

页数：4

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