Novel high Tg low dielectric constant coil-shaped polymer

被引:18
作者
Fujiwara, T [1 ]
Shinba, Y [1 ]
Sugimoto, K [1 ]
Mori, Y [1 ]
Tomikawa, M [1 ]
机构
[1] Toray Industries Ltd, Elect & Imaging Mat Res Labs, Shiga 5200842, Japan
关键词
poly(norbornene imide)s; dielectric constant; high glass transition temperature; elastic modulus;
D O I
10.2494/photopolymer.18.289
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
This paper reports that the novel high Tg low dielectric constant polymer with highly rigid coil-shaped main-chain structure was obtained for interlayer dielectric applications in microelectronics. The low dielectric constant of the polymer was induced by it that the coil-shaped main-chain structure with a bulky side-chain out of the main-chain. The coil-shaped structure leads to decrease packing density and increase free volume. The polymer was exhibited low dielectric constant (2.31) without pore. The glass transition temperature of the polymer is higher than 400 degrees C. TGA shows that the polymer was heat stable higher than 350 degrees C under nitrogen flow. The elastic modulus of the polymer is 4.3 GPa. The film is able to be prepared with lower temperature (at solvent boiling point). The polymer prepared is novel poly(norbornene imide)s containing bulky fluorinated aryl unit in side-chain. We confirmed that the fluorinated poly(norbornene imide)s displays a coil-shaped a main-chain polymer structure by molecular simulation. The syntheses of the fluorinated poly(norbornene imide)s are described in this paper.
引用
收藏
页码:289 / 295
页数:7
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