Analysis and evaluation of multisite testing for VLSI

被引:7
作者
Hashempour, H [1 ]
Meyer, FJ
Lombardi, F
机构
[1] LTX Corp, IC Dev & Appl Res, San Jose, CA 95134 USA
[2] Wichita State Univ, Dept Elect & Comp Engn, Wichita, KS 67260 USA
[3] Northeastern Univ, Dept Elect & Comp Engn, Boston, MA 02115 USA
关键词
automatic test equipment (ATE); built-in self test (BIST); fault coverage; multisite testing; yield;
D O I
10.1109/TIM.2005.855099
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper deals with multisite testing of VLSI chips in a manufacturing environment. Multisite testing is analyzed and evaluated using device-under-test (DUT) parameters (such as yield and average number of faults per DUT) as well as test process features (such as number of channels, fault coverage, and touchdown time for the head). The presence of idle time periods and their impact on the multisite test time is analyzed in depth. Two hybrid testing scenarios which combine built-in self-test (BIST) and automatic test equipment (ATE) are proposed and analytical models are provided to establish the corresponding multisite test time. It is shown that a hybrid approach based on screening chips through a BIST stage improves the performance of multisite test and allows a better utilization of channels in the head of an ATE.
引用
收藏
页码:1770 / 1778
页数:9
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