Influence of bandstructure and channel structure on the inversion layer capacitance of silicon and GaAs MOSFETs

被引:33
作者
Pal, Himadri S. [1 ]
Cantley, Kurtis D. [2 ]
Ahmed, Shaikh Shahid [3 ]
Lundstrom, Mark S. [1 ]
机构
[1] Purdue Univ, Sch Elect & Comp Engn, W Lafayette, IN 47907 USA
[2] Univ Texas Dallas, Sch Elect Engn, Richardson, TX 75080 USA
[3] So Illinois Univ, Sch Elect & Comp Engn, Carbondale, IL 62901 USA
关键词
Capacitance; inversion layers; quantum effect; subband energy;
D O I
10.1109/TED.2007.914830
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The influence of MOSFET channel material and channel structure on the inversion layer capacitance is examined. It is well known that the inversion layer capacitance depends strongly on the bandstructure of the channel, but we show that it also depends very strongly on the structure of the channel (e.g., bulk vs. ultrathin body, and the thickness of the body). These results provide some general insights into the channel material and structure tradeoffs that control the inversion layer capacitance-an increasingly important consideration as electrical oxide thicknesses continue to decrease and as new channel materials are considered.
引用
收藏
页码:904 / 908
页数:5
相关论文
共 23 条
[1]   TRANSCONDUCTANCE DEGRADATION IN THIN-OXIDE MOSFETS [J].
BACCARANI, G ;
WORDEMAN, MR .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1983, 30 (10) :1295-1304
[3]   Diagonal parameter shifts due to nearest-neighbor displacements in empirical tight-binding theory [J].
Boykin, TB ;
Klimeck, G ;
Bowen, RC ;
Oyafuso, F .
PHYSICAL REVIEW B, 2002, 66 (12) :1252071-1252076
[4]  
CHAU R, 2006, P DEV RES C, P3
[5]  
Colinge J. P., 1990, International Electron Devices Meeting 1990. Technical Digest (Cat. No.90CH2865-4), P595, DOI 10.1109/IEDM.1990.237128
[6]  
Datta S., 2005, QUANTUM TRANSPORT AT
[7]   Analytical models for the insight into the use of alternative channel materials in ballistic nano-MOSFETs [J].
De Michielis, Marco ;
Esseni, David ;
Driussi, Francesco .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2007, 54 (01) :115-123
[8]   High performance fully-depleted tri-gate CMOS transistors [J].
Doyle, BS ;
Datta, S ;
Doczy, M ;
Hareland, S ;
Jin, B ;
Kavalieros, J ;
Linton, T ;
Murthy, A ;
Rios, R ;
Chau, R .
IEEE ELECTRON DEVICE LETTERS, 2003, 24 (04) :263-265
[9]  
Huang X., 1999, IEDM Tech. Dig, P67, DOI DOI 10.1109/IEDM.1999.823848
[10]  
Kim DH, 2005, INT EL DEVICES MEET, P787