A robust Co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS

被引:64
作者
Shih, CL [1 ]
Lai, BK
Kahn, H
Phillips, SM
Heuer, AH
机构
[1] Case Western Reserve Univ, Dept Mat Sci & Engn, Cleveland, OH 44106 USA
[2] Case Western Reserve Univ, Dept Elect Engn & Comp Sci, Cleveland, OH 44106 USA
关键词
microactuators; shape-memory alloys; sputtering; TiNi;
D O I
10.1109/84.911094
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Co-sputtering has been used to fabricate equiatomic thin films of TiNi, a shape memory alloy which form the basis of microactuators with many applications in MEMS. Methods for overcoming the difficulties involved in obtaining equiatomic TiNi thin films with high transformation temperatures, and a robust procedure suitable for batch fabrication in a production environment, are described.
引用
收藏
页码:69 / 79
页数:11
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