DSC analysis of epoxy molding compound with plasma polymer-coated silica fillers

被引:7
|
作者
Roh, JH
Lee, JH
Kim, NI
Kang, HM
Yoon, TH [1 ]
Song, KH
机构
[1] Kwangju Inst Sci & Technol, Dept Mat Sci & Engn, Kwangju 500712, South Korea
[2] Paichai Univ, Dept Clothing & Text, Taejon 302635, South Korea
关键词
epoxy molding compounds (EMC); coatings; adhesion; differential scanning calorimetry (DSC); FTIR;
D O I
10.1002/app.12914
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Silica fillers were modified by plasma-polymerization coating of 1,3-diaminopropane, allylamine, pyrrole, 1,2-epoxy-5-hexene, allylmercaptan, and allylalcohol using RF plasma (13.56 MHz). Modified fillers were then mixed with biphenyl epoxy resin, phenol novolac (curing agent), and optionally triphenylphosphine (catalyst) to prepare samples for DSC analyses. Some samples were also prepared from uncoated silica fillers and monomers used in plasma polymerization coating, instead of plasma polymer-coated silica fillers. Plasma polymer-coated silica fillers were characterized by FTIR, XPS, and water contact angle measurements. In DSC analyses, all samples with plasma polymer-coated silica fillers showed a large peak and an additional one or two small exothermic peaks when catalyst was added, compared to only one large peak with as-received silica fillers. The large peak could be from epoxy-phenol novolac reaction in the presence of catalyst, whereas small reaction peaks were attributed to the chemical reaction between epoxy resin and functional moieties in the plasma polymer coating, such as amine, OH, and/or SH groups, as evidenced by FTIR and XPS analysis and contact angle measurements. (C) 2003 Wiley Periodicals, Inc.
引用
收藏
页码:2508 / 2516
页数:9
相关论文
共 50 条
  • [1] Optimal Packing Research of Spherical Silica Fillers Used in Epoxy Molding Compound
    Mei, Hujie
    Du, Xinyu
    Li, Lanxia
    Tan, Wei
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 547 - 550
  • [2] Plasma polymerization coating of silica fillers for epoxy molding compounds (EMCs)
    Yoon, T.H. (thyoon@kjist.ac.kr), 1600, VSP BV (17):
  • [3] Plasma polymerization coating of silica fillers for Epoxy Molding Compounds (EMCs)
    Lee, JH
    Roh, JH
    Yoon, TH
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2003, 17 (03) : 383 - 396
  • [4] Study of heat of reaction between plasma-polymer-coated silica fillers and biphenyl epoxy resin
    Kim, N.I.
    Kang, H.M.
    Yoon, T.H.
    Journal of Adhesion Science and Technology, 2004, 18 (12): : 1325 - 1338
  • [5] Study of heat of reaction between plasma-polymer-coated silica fillers and biphenyl epoxy resin
    Kim, NI
    Kang, HM
    Yoon, TH
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2004, 18 (12) : 1325 - 1338
  • [6] The properties of epoxy resin coated silica fillers composites
    Teh, P. L.
    Mariatti, M.
    Akil, H. M.
    Yeoh, C. K.
    Seetharamu, K. N.
    Wagiman, A. N. R.
    Beh, K. S.
    MATERIALS LETTERS, 2007, 61 (11-12) : 2156 - 2158
  • [7] CLOSE PACKING OF POLYMER-COATED MONODISPERSE SILICA
    JIANG, M
    WANG, SK
    JIN, XL
    JOURNAL OF MATERIALS SCIENCE LETTERS, 1990, 9 (11) : 1272 - 1273
  • [8] CHARACTERIZATION OF POLYMER-COATED SILICA PARTICLES BY MICROELECTROPHORESIS
    SPRYCHA, R
    OYAMA, HT
    ZELENEV, A
    MATIJEVIC, E
    COLLOID AND POLYMER SCIENCE, 1995, 273 (07) : 693 - 700
  • [9] Enhanced adhesion of silica for epoxy molding compounds (EMCs) by plasma polymer coatings
    Roh, JH
    Lee, JH
    Yoon, TH
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2002, 16 (11) : 1529 - 1543
  • [10] The Effects of Silica-Based Fillers on the Properties of Epoxy Molding Compounds
    Linec, Mitja
    Music, Branka
    MATERIALS, 2019, 12 (11)