Simulation of the backward current in polycrystalline silicon thin-film transistors

被引:1
|
作者
Baudet, M [1 ]
Lhermite, H [1 ]
Mohammed-Brahim, T [1 ]
机构
[1] Univ Rennes 1, Grp Microelect & Visualisat, UPRESA 6076, CNRS, FR-35042 Rennes, France
来源
POLYCRYSTALLINE SEMICONDUCTORS IV MATERIALS, TECHNOLOGIES AND LARGE AREA ELECTRONICS | 2001年 / 80-81卷
关键词
modelling; polysilicon; TFT;
D O I
10.4028/www.scientific.net/SSP.80-81.379
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Many of previous electrical simulations of the channel current under reverse bias conditions in a polycrystalline silicon thin film transistors assume an homogeneous material with an uniformly distributed defect density. Nevertheless, polycrystalline silicon, particularly laser crystallised silicon, is an inhomogeneous material with large crystallised regions, the grains, and disordered thin interfaces, the grain boundaries. Within the device simulator Atlas, we introduced this more realistic model of polycrystalline material, with monocrystalline grains of size L, separated by amorphous grain boundaries of size e, to reproduce the reverse current behaviour of polysilicon thin film transistors. The experimental reverse current generally shows an exponential increase versus the reverse bias. With the introduction of a generation model with carriers band to band tunnelling, the exponential behaviour of the backward channel current with respect to the reverse bias voltage can be accounted for.
引用
收藏
页码:379 / 384
页数:6
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