共 50 条
- [24] Characterization of tungsten carbide as diffusion barrier for Cu metallization JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2001, 40 (4B): : 2642 - 2649
- [27] Effect of film microstructure on diffusion barrier properties of TaN x films in Cu metallization 1600, Japan Society of Applied Physics (47): : 6953 - 6955
- [28] Characterization of tungsten carbide as diffusion barrier for Cu metallization Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2001, 40 (4 B): : 2642 - 2649