Gas flow optimization during the cooling of multicrystalline silicon ingot

被引:20
|
作者
Wang, S. [1 ]
Fang, H. S. [1 ]
Zhao, C. J. [1 ]
Zhang, Z. [1 ]
Zhang, M. J. [1 ]
Xu, J. F. [2 ]
机构
[1] Huazhong Univ Sci & Technol, Sch Energy & Power Engn, Wuhan 430074, Peoples R China
[2] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan 430074, Peoples R China
基金
中国国家自然科学基金;
关键词
Multicrystalline silicon; Directional solidification; Stresses; Gas flow; Cooling process; UNIDIRECTIONAL SOLIDIFICATION PROCESS; DIRECTIONAL SOLIDIFICATION; THERMAL-STRESS; SOLAR-CELLS; DISLOCATION; GENERATION; FURNACE;
D O I
10.1016/j.ijheatmasstransfer.2015.01.035
中图分类号
O414.1 [热力学];
学科分类号
摘要
Multicrystalline silicon (mc-Si) produced by unidirectional solidification system is a crucial photovoltaic material due to its relatively high conversion efficiency and low cost. Defects related to thermal stresses, for example, dislocation, significantly affect the performance of the material. In the paper, a global transient model is applied to examine effects of gas flow on stress levels inner the silicon ingot during the cooling process. The maximum von Mises stresses under different inlet gas velocities are presented as a function of the cooling time. Stress level with a high inlet velocity at the initial cooling is slightly lower, but is much larger at the late cooling than that with a slow velocity. An optimized condition with variable gas velocities at the inlet is proposed to improve the quality of silicon ingot by reducing the stress level during the cooling process. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码:370 / 375
页数:6
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