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Atomic-Scale Mechanisms of Sliding along an Interdiffused Li-Si-Cu Interface
被引:15
|作者:
Wang, Haoran
[1
]
Hou, Binyue
[1
]
Wang, Xueju
[2
]
Xia, Shuman
[2
]
Chew, Huck Beng
[1
]
机构:
[1] Univ Illinois, Dept Aerosp Engn, Urbana, IL 61801 USA
[2] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA
基金:
美国国家科学基金会;
关键词:
silicon electrode;
copper current collector;
interface sliding;
delamination;
density functional theory;
LITHIUM-ION BATTERIES;
THIN-FILM ELECTRODES;
LITHIATED SILICON;
FRACTURE;
CAPACITY;
STORAGE;
ALLOYS;
ANODE;
D O I:
10.1021/nl5043837
中图分类号:
O6 [化学];
学科分类号:
0703 ;
摘要:
We perform ab initio calculations On the shear deformation response of the interdiffused Li-Si-Cu phase structure existing between a lithiated Si electrode and a Cu current collector. We show that the formation of well-delineated and weakly bonded Si-Cu and Li-Cu crystalline atomic layers within this phase structure, facilitates interface sliding. HoweVer, sliditig can be terminated by the-formation of LiSi3 compounds across these atomic layers, which causes the abrupt capacity fade of the electrode aftet repeated cycling.
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页码:1716 / 1721
页数:6
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