A novel ultrasonic consolidation method for rapid preparation of diamond/Cu composites

被引：8
作者：
Wang, Bo [1 ,2 ,3 ]
Zhang, Hongtao [1 ,2 ,3 ]
Yu, Guo [2 ]
Du, Rongmao [2 ]
He, Peng [1 ,2 ]
机构：
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
[2] Harbin Inst Technol Weihai, Shandong Prov Key Lab Special Welding Technol, Weihai 264209, Peoples R China
[3] Shandong Inst Shipbldg Technol, Inst Shipwelding Technol, Weihai 264209, Peoples R China
来源：
MATERIALS LETTERS | 2022年 / 323卷
基金：
中国国家自然科学基金;
关键词：
Interfaces; Laminates; Thermal properties; Diamond/Cu composites; Surface metalization; Ultrasonic Consolidation; THERMAL-CONDUCTIVITY;
D O I：
10.1016/j.matlet.2022.132498
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this study, diamond/Cu composites were fabricated using ultrasonic consolidation and resistance rapid diffusion technology with Cr addition to improve the wettability between diamond and Cu martix, the interfacial configuration and thermal conductivity of diamond/Cu composites were also investigated. Excellent interfacial bonding between diamond and Cu matrix was achieved by surface metallization of diamond with Cr, and the formation of subgrain boundaries was observed in the Cr7C3 and Cu matrix grains near the interface. The thermal conductivity of the composite prepared by this process reaches 421.314 W/m.K when diamond added mass at 1.34%, which is 12% higher than that of the Cu matrix.
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页数：4
相关论文
共 9 条
  • [1] Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix
    Bai, Guangzhu
    Wang, Luhua
    Zhang, Yongjian
    Wang, Xitao
    Wang, Jinguo
    Kim, Moon J.
    Zhang, Hailong
    [J]. MATERIALS CHARACTERIZATION, 2019, 152 : 265 - 275
  • [2] Research progress of diamond/copper composites with high thermal conductivity
    Dai, Shugang
    Li, Jinwang
    Lu, Ningxiang
    [J]. DIAMOND AND RELATED MATERIALS, 2020, 108
  • [3] Multifunctional Thermal Management Materials with Excellent Heat Dissipation and Generation Capability for Future Electronics
    Feng, Chang-Ping
    Chen, Li-Bo
    Tian, Guo-Liang
    Wan, Shen-Shen
    Bai, Lu
    Bao, Rui-Ying
    Liu, Zheng-Ying
    Yang, Ming-Bo
    Yang, Wei
    [J]. ACS APPLIED MATERIALS & INTERFACES, 2019, 11 (20) : 18739 - 18745
  • [4] Effect of Ag/Cu matrix composition on thermal properties of diamond/Ag/Cu-Ti composites fabricated by pressureless sintering
    Jhong, Yu-Siang
    Hsieh, Meng-Chun
    Lin, Su-Jien
    [J]. MATERIALS LETTERS, 2019, 254 : 316 - 319
  • [5] High thermal conductive copper/diamond composites: state of the art
    Jia, S. Q.
    Yang, F.
    [J]. JOURNAL OF MATERIALS SCIENCE, 2021, 56 (03) : 2241 - 2274
  • [6] High thermal conductivity and strong interface bonding of a hot-forged Cu/Ti-coated-diamond composite
    Lei, L.
    Bolzoni, L.
    Yang, F.
    [J]. CARBON, 2020, 168 : 553 - 563
  • [7] [桑健 Sang Jian], 2018, [材料导报, Materials Review], V32, P3199
  • [8] Unveiling the interfacial configuration in diamond/Cu composites by using statistical analysis of metallized diamond surface
    Zhang, Hongdi
    Zhang, Jingjing
    Liu, Yue
    Zhang, Fan
    Fan, Tongxiang
    Zhang, Di
    [J]. SCRIPTA MATERIALIA, 2018, 152 : 84 - 88
  • [9] Reinforcement size effect on thermal conductivity in Cu-B/diamond composite
    Zhang, Yongjian
    Bai, Guangzhu
    Liu, Xiaoyan
    Dai, Jingjie
    Wang, Xitao
    Zhang, Hailong
    [J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2021, 91 (91): : 1 - 4
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