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- [3] Numerical and experimental studies of 3D hypersonic inlet Journal of Thermal Science, 2002, 11 : 198 - 206
- [4] Design method for hypersonic bump inlet based on transverse pressure gradient JOURNAL OF ZHEJIANG UNIVERSITY-SCIENCE A, 2022, 23 (06): : 479 - 494
- [5] Electromigration Immortality of Purely Intermetallic Micro -bump for 3D Integration 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 620 - 625
- [6] Electro- and Thermomigration in Micro Bump Interconnects for 3D Integration 2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 1444 - 1451
- [7] Generic Rules to Achieve Bump Electromigration Immortality for 3D IC Integration 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 49 - 57
- [8] High Reliability Insert-Bump Bonding Process for 3D Integration 2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2013,
- [10] Integration method for 3D model reconstruction THREE-DIMENSIONAL IMAGE CAPTURE AND APPLICATIONS VI, 2004, 5302 : 125 - 135