Efficient full-wave analysis of multilayer interconnection structures using a novel domain decomposition model order reduction method

被引：0
|
作者：
Lee, Shih-Hao [1 ]
Jin, Jian-Nfing [1 ]
机构：
[1] Univ Illinois, Dept Elect & Comp Engn, Ctr Computat Electromagnet, Urbana, IL 61801 USA
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2007年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
An efficient domain decomposition-model order reduction method is proposed for a fast broadband finite-element analysis of multilayer interconnection structures. Significant enhancement in the computational efficiency is achieved while still maintaining the strong capability of geometry and material modeling as well as the full-wave accuracy.
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收藏
页码：69 / +
页数：2
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