[3] US Army, RDECOM CERDEC Night Vis & Elect Sensors Directora, Ft Belvoir, VA 22060 USA
来源:
QUANTUM SENSING AND NANOPHOTONIC DEVICES IX
|
2012年
/
8268卷
关键词:
Solid-state microdisplays;
self-emissive displays;
micro-LED array;
III-nitride wide bandgap semiconductors;
III-V and CMOS integration;
active drive;
flip-chip bonding;
LIGHT-EMITTING-DIODES;
DEVICES;
D O I:
10.1117/12.914061
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
Micro-size light emitting diode (mu LED) arrays based on III-nitride semiconductors have emerged as a promising technology for a wide range of applications. If InGaN mu LED arrays can be integrated on to Si complementary metal-oxide-semiconductor (CMOS) substrates for active driving, these devices could play crucial roles in ultra-portable products such as next generation pico-projectors, as well as in emerging fields such as biophotonics and optogenetics. Here we present a demonstration of, and methods for, creating a high-resolution solid-state self-emissive microdisplay based on InGaN/GaN semiconductors. An energy efficient active drive scheme is accomplished by integrating micro-emitter arrays with CMOS active matrix drivers that are flip-chip bonded together via indium metal bumps.
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[1]
Jiang H., 2002, US Patent, Patent No. [6,410,940, 6410940]