Precision laser ablation of dielectrics in the 10-fs regime

被引：113

作者：

Lenzner, M

Krüger, J

Kautek, W

Krausz, F

机构：

[1] Vienna Tech Univ, A-1040 Vienna, Austria

[2] Bundesanstalt Mat Forsch & Prufung, D-12205 Berlin, Germany

来源：

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 1999年 / 68卷 / 03期

关键词：

D O I：

10.1007/s003390050906

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Laser pulses in the 10-fs domain provide a quality of micromachining of fused silica and borosilicate glass that is unobtainable with longer pulses in the range of several 100 femtoseconds up to picoseconds. The shortening of the pulses reduces the statistical behavior of the material removal and the ablation process thus attains a more deterministic and reproducible character. The improved reproducibility of ablation is accompanied by significantly smoother morphology. This offers the potential for lateral and vertical machining precision of the order of 100 nm and 10 nm, respectively.

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收藏

页码：369 / 371

页数：3

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