Effect of holding time on microstructure and mechanical properties of Si3N4/Si3N4 joints brazed with Au58.7Ni36.5V4.8 filler alloy

被引:1
作者
Sun, Y. [1 ]
Zhang, J. [1 ]
Fan, G. H. [1 ]
He, Y. M. [1 ]
Shibayanagi, T. [2 ]
机构
[1] Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
[2] Osaka Univ, Joining & Welding Res Inst, Osaka 5670047, Japan
关键词
SILICON-NITRIDE; TRANSIENT LIQUID; AU-NI; METAL; MOLYBDENUM; COMPOSITE; STRENGTH; SYSTEM; FOIL;
D O I
10.1007/s10853-011-5539-z
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Si3N4 ceramics were brazed using Au-Ni-V metal foils at 1423 K for different holding times. Effect of holding time on microstructure and mechanical properties of the joints was investigated. The results indicate that a reaction layer of VN exists at the interface between Si3N4 ceramic and filler alloy. With increasing holding time from 0 to 90 min, thickness of the VN reaction layer increases from 0.4 to 2.8 mu m, obeying a linear relation. Mechanism of the interfacial reaction was discussed by calculating the formation of free energy of VN. No specific orientation relationship exists between VN reaction layer and Si3N4 ceramic. In addition, Ni3Si intermetallic compound appears in the joint when the holding time increases to 90 min, resulting in the deterioration of the joint strength.
引用
收藏
页码:5830 / 5837
页数:8
相关论文
共 25 条
[1]  
Barin I., 1995, THERMOCHEMICAL DATA, V1, DOI DOI 10.1002/9783527619825
[2]   Microstructure and mechanical behavior of in situ Ni-Ni3Si composite [J].
Dutra, A. T. ;
Ferrandini, P. L. ;
Caram, R. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2007, 432 (1-2) :167-171
[3]  
EISAYED MH, 1998, J MATER SCI, V33, P2869, DOI DOI 10.1023/A:1017546105704
[4]   Microstructure and mechanical properties of Si3N4/Si3N4 joint brazed with Ag-Cu-Ti plus SiCp composite filler [J].
He, Y. M. ;
Zhang, J. ;
Liu, C. F. ;
Sun, Y. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2010, 527 (12) :2819-2825
[5]   JOINING OF SILICON-CARBIDE AND MOLYBDENUM WITH VANADIUM FOIL [J].
ITO, Y ;
JINBO, T .
MATERIALS TRANSACTIONS JIM, 1993, 34 (10) :966-968
[6]   Interfacial microstructure of partial transient liquid phase bonded Si3N4-to-Inconel 718 joints [J].
Kim, JJ ;
Park, JW ;
Eagar, TW .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2003, 344 (1-2) :240-244
[7]   Residual stresses in ultrathin metal sublayers within Au/Ni multilayers [J].
Labat, S ;
Gergaud, P ;
Thomas, O ;
Gilles, B ;
Marty, A ;
Lefebvre, S .
MAGNETIC ULTRATHIN FILMS, MULTILAYERS AND SURFACES - 1997, 1997, 475 :363-368
[8]   Joining of silicon nitride with a titanium foil interlayer [J].
Lemus, J ;
Drew, RAL .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2003, 352 (1-2) :169-178
[9]   Infrared brazing of Mo using the 70Au-22Ni-8Pd alloy [J].
Liaw, DW ;
Shiue, RK .
INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, 2005, 23 (02) :91-97
[10]   Effect of Ti content on microstructure and strength of Si3N4/Si3N4 joints brazed with Cu-Pd-Ti filler metals [J].
Liu, C. F. ;
Zhang, J. ;
Zhou, Y. ;
Meng, Q. C. ;
Naka, M. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 491 (1-2) :483-487