Development of filtered DC metal plasma ion implantation and coating deposition methods based on high-frequency short-pulsed bias voltage application

被引:19
作者
Ryabchikov, AI [1 ]
Ryabchikov, IA [1 ]
Stepanov, IB [1 ]
机构
[1] Tomsk Polytech Univ, Inst Phys Nucl, Tomsk 634034, Russia
关键词
metal plasma; short-pulsed; high-frequency; immersion implantation;
D O I
10.1016/j.vacuum.2005.01.046
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
An innovative concept in the development of advanced coating deposition and ion implantation method including an application of filtered DC metal plasma source and high-frequency short-pulsed negative bias voltage with a duty factor in the range 10-99% are considered. The regularities of ion implantation and metal plasma deposition for metal and dielectric samples are experimentally investigated. Experimentally, it has been shown that metal plasma-based ion implantation, high-concentration metal plasma ion implantation with compensation of ion surface sputtering by metal plasma deposition and ion-assisted coating deposition can be realized by variation of bias potential ranging from 0 V to 4 kV, with pulse repetition rate smoothly adjusted in the range (2-4.4) x 10(5) PPS and pulse duration ranging from 0.5 to 2 mu s. Special features of the material treatment method depending on plasma concentration, pulse repetition rate and duty factor have been examined. (c) 2005 Elsevier Ltd. All rights reserved.
引用
收藏
页码:331 / 336
页数:6
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