Grain boundary surface tension, segregation and diffusion in Cu-Sn system

被引：0

作者：

Evgeny, Gershman ^{[1
]}

Sergey, Zhevnenko ^{[1
]}

机构：

[1] Technol Univ, Moscow State Inst Steel & Alloys, 4 Leninsky Pr, Moscow 119049, Russia

来源：

DS 2006: DIFFUSION AND STRESSES | 2007年 / 264卷

关键词：

grain boundary tension; grain boundary adsorption; free surface tension; zero creep method; grain boundary diffusion;

D O I：

暂无

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Grain boundary and free surface tension for pure copper and copper-tin alloys are measured. On the base of these data isothermes of grain boundary tension, free surface tension and isothermes of adsorption are constructed in assumption of a dilute solution. Grain boundary diffusion coefficients of copper were calculated by using the relation of Borisov et. al. for copper and copper-tin alloys.

引用

页码：39 / +

页数：3

共 12 条

[1] Bokstein B.S., 2005, Thermodynamics and kinetics in materials science
[2] Borisov VT., 1964, PHYS MET METALLOGR, V17, P80
[3] Fujikawa S., 1982, Point Defects and Defect Interactions in Metals. Proceedings of the Yamada Conference V, P554
[4] DETERMINATION OF THE INTERFACIAL-TENSION BY THERMAL GROOVING AND ZERO CREEP IN COAXIAL WIRES THEORY
GENIN, FY
[J]. ACTA METALLURGICA ET MATERIALIA, 1994, 42 (11): : 3881 - 3885
[5] FORMULATION OF ZERO CREEP METHOD FOR SMALL DIAMETER WIRES
GREENBERG, MD
PRYOR, JN
ELBAN, WL
[J]. MATERIALS SCIENCE AND ENGINEERING, 1978, 33 (01): : 63 - 67
[6] SOLUTE ENHANCEMENT OF SELF-DIFFUSION OF COPPER IN COPPER TIN, COPPER INDIUM AND COPPER ANTIMONY DILUTE ALLOYS
HOSHINO, K
IIJIMA, Y
HIRANO, KI
[J]. ACTA METALLURGICA, 1982, 30 (01): : 265 - 271
[7] GRAIN-BOUNDARY TERM IN SURFACE-ENERGY MEASUREMENT BY ZERO CREEP
JONES, H
[J]. SCRIPTA METALLURGICA, 1972, 6 (06): : 423 - &
[8] DETERMINATION OF THE INTERFACIAL-TENSION BY ZERO CREEP EXPERIMENTS ON MULTILAYERS .1. THEORY
JOSELL, D
SPAEPEN, F
[J]. ACTA METALLURGICA ET MATERIALIA, 1993, 41 (10): : 3007 - 3015
[9] THEORY OF THERMAL GROOVING
MULLINS, WW
[J]. JOURNAL OF APPLIED PHYSICS, 1957, 28 (03) : 333 - 339
[10] Grain boundary self-diffusion in Cu polycrystals of different purity
Surholt, T
Herzig, C
[J]. ACTA MATERIALIA, 1997, 45 (09) : 3817 - 3823

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