Interfacial strength development of roll-bonded aluminium/copper metal laminates

被引:71
作者
Heness, G. [1 ]
Wuhrer, R. [2 ]
Yeung, W. Y. [1 ]
机构
[1] Univ Technol Sydney, Dept Chem Mat & Forens Sci, Sydney, NSW 2007, Australia
[2] Univ Technol Sydney, Microstruct Anal Unit, Sydney, NSW 2007, Australia
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2008年 / 483-84卷 / 1-2 C期
关键词
metal laminates; peel strength; interfaces;
D O I
10.1016/j.msea.2006.09.184
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The development of the phases in the interface of roll-bonded Al/Cu metal laminates controls the strength. Phase development as a function of sintering time was monitored via X-ray diffraction and X-ray mapping. Both techniques revealed essentially the same phase presence and highlighted a limitation of X-ray diffraction. Initial rolling reduction has no effect on phase development but does affect the interface thickness. (c) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:740 / 742
页数:3
相关论文
共 9 条
[1]  
KRASULIN YL, 1967, PHYS CHEM MATS PROCE, V1, P1252
[2]   Interface development in sintering of roll bonded metal laminates [J].
Lee, Malik ;
Wuhrer, Richard ;
Yeung, Wing Yiu .
HEAT TREATMENT OF MATERIALS, 2006, 118 :437-+
[3]   Effect of rolling temperature on interface and bond strength development of roll bonded copper/aluminium metal laminates [J].
Peng, XK ;
Heness, G ;
Yeung, WY .
JOURNAL OF MATERIALS SCIENCE, 1999, 34 (02) :277-281
[4]   On the interface development and fracture behaviour of roll bonded copper aluminium metal laminates [J].
Peng, XK ;
Wuhrer, R ;
Heness, G ;
Yeung, WY .
JOURNAL OF MATERIALS SCIENCE, 1999, 34 (09) :2029-2038
[5]  
PENG XK, 1997, P INT C THERM PROC S, P1263
[6]  
PENG XK, 1997, P 11 INT C COMP MAT, P119
[7]  
SHORSHOROV MKH, 1967, WELD PROD, V14, P24
[8]  
SHORSHOROV MKH, 1970, P C ADV WELD PROC MO, P208
[9]  
TYLECOTE RF, 1968, SOLID PHASE WELDING, P18