A High-Performance SiC Super-Junction MOSFET With a Step-Doping Profile

被引:7
作者
Huang, Hao [1 ]
Wang, Ying [1 ]
Yu, Cheng-Hao [1 ]
Tang, Zhao-Huan [2 ]
Li, Xing-Ji [3 ]
Yang, Jian-Qun [3 ]
Cao, Fei [1 ]
机构
[1] Hangzhou Dianzi Univ, Key Lab RF Circuits & Syst, Minist Educ, Hangzhou 310018, Peoples R China
[2] China Elect Technol Grp Corp, Natl Key Lab Analog Integrated Circuits, Chongqin 400060, Peoples R China
[3] Harbin Inst Technol, Natl Key Lab Mat Behav & Evaluat Technol Space En, Harbin 150080, Peoples R China
来源
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY | 2021年 / 9卷
基金
中国国家自然科学基金;
关键词
Silicon carbide; Electric fields; MOSFET; Semiconductor process modeling; Performance evaluation; Logic gates; JFETs; SiC MOSFET; breakdown voltage; specific on-resistance; figure of merit; SINGLE-EVENT BURNOUT; IMPACT IONIZATION COEFFICIENTS; POWER; MOBILITY; DIODES; LAYERS; 6H;
D O I
10.1109/JEDS.2021.3125706
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this article, we investigate a 4H-SiC super- junction (SJ) MOSFET structure with a charge-imbalance doping-profile. According to our numerical simulations and comparisons with the conventional SiC VDMOS (C-VDMOS) and SiC SJ VDMOS (SJ-VDMOS) devices, the SJ-MOD structure offers a better trade-off between breakdown voltage (BV) and specific on-resistance (R-on,R-sp). This leads to a high figure of merit (FOM=BV2/R-on,R-sp). In addition, due to the reduced electric field peak, the single-event burnout (SEB) of the device is significantly improved. The simulation results indicate that, using a LET value of 0.1 pC/mu m and a 3000K global device temperature as the criterion for burning, the specific burnout-threshold voltage (using the optimal parameters of the proposed structure) exceeds that of the conventional structure. This indicates that the modified super-junction structure can indeed be used for different voltage-classes of the hardening SiC super-junction devices in the future.
引用
收藏
页码:1084 / 1092
页数:9
相关论文
共 50 条
  • [31] Analysis of breakdown voltage and on resistance of super-junction power MOSFET CoolMOS™ using theory of novel voltage sustaining layer
    Kondekar, PN
    Parikh, CD
    Patil, MB
    PESC'02: 2002 IEEE 33RD ANNUAL POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-4, CONFERENCE PROCEEDINGS, 2002, : 1769 - 1775
  • [32] New super junction lateral double-diffused MOSFET with electric field modulation by differently doping the buffered layer
    Duan Bao-Xing
    Cao Zhen
    Yuan Song
    Yuan Xiao-Ning
    Yang Yin-Tang
    ACTA PHYSICA SINICA, 2014, 63 (24) : 247301
  • [33] Super-Junction Power MOSFET in Half Bridge DC-DC Zero-Voltage Converter for Energy Conversion Management
    Musumeci, S.
    Cristaldi, D.
    Portoghese, F.
    2015 INTERNATIONAL CONFERENCE ON CLEAN ELECTRICAL POWER (ICCEP), 2015, : 755 - 760
  • [34] Investigation of a 4H-SiC Trench MOSFET with Back-Side Super Junction
    Zhang, Lili
    Liu, Yuxuan
    Fang, Junpeng
    Liu, Yanjuan
    MICROMACHINES, 2022, 13 (10)
  • [35] Investigations of SiC lateral MOSFET with high- k and equivalent variable lateral doping techniques
    Kong, Moufu
    Deng, Hongfei
    Luo, Yingzhi
    Zhu, Jiayan
    Yi, Bo
    Yang, Hongqiang
    Hu, Qiang
    Meng, Fanxin
    MICROELECTRONICS JOURNAL, 2024, 150
  • [36] Optimisation of lateral super-junction multi-gate MOSFET for high drive current and low specific on-resistance in sub-100 V applications
    Adenekan, Olujide
    Holland, Paul
    Kalna, Karol
    MICROELECTRONICS JOURNAL, 2018, 81 : 94 - 100
  • [37] A 4H-SiC semi-super-junction shielded trench MOSFET: p-pillar is grounded to optimize the electric field characteristics
    Wang, Xiaojie
    Shen, Zhanwei
    Zhang, Guoliang
    Miao, Yuyang
    Li, Tiange
    Zhu, Xiaogang
    Cai, Jiafa
    Hong, Rongdun
    Chen, Xiaping
    Lin, Dingqu
    Wu, Shaoxiong
    Zhang, Yuning
    Fu, Deyi
    Wu, Zhengyun
    Zhang, Feng
    JOURNAL OF SEMICONDUCTORS, 2022, 43 (12)
  • [38] High Performance SiC MOSFET Module for Industrial Applications
    Stevanovic, Ljubisa
    Rowden, Brian
    Harfman-Todorovic, Maja
    Losee, Peter
    Bolotnikov, Alexander
    Kennedy, Stacey
    Schuetz, Tobias
    Carastro, Fabio
    Datta, Rajib
    Tao, Fengfeng
    Raju, Ravi
    Cioffi, Philip
    2016 28TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2016, : 479 - 482
  • [39] A Novel Nanoscale 4H-SiC-on-Insulator MOSFET Using Step Doping Channel
    Orouji, Ali A.
    Elahipanah, Hossein
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2010, 10 (01) : 92 - 95
  • [40] Monitoring of SiC MOSFET junction temperature with on-state voltage at high currents
    Zheng D.
    Kang Y.
    Cao H.
    Chai X.
    Fan T.
    Ning P.
    1600, Institute of Electrical and Electronics Engineers Inc. (06): : 1 - 7