Electrostatic discharge in semiconductor devices: Protection techniques

被引:29
|
作者
Vinson, JE [1 ]
Liou, JJ
机构
[1] Intersil Corp, Melbourne, FL 32902 USA
[2] Univ Cent Florida, Dept Elect & Comp Engn, Orlando, FL USA
关键词
air ionizers; electrostatic discharge; ESD protection; ESD safe packaging; ESD safe workstation; floor finishes; input protection; static clamps; static dissipation; transient clamps;
D O I
10.1109/5.899057
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Electrostatic discharges (ESDs) are everywhere-in our homes and businesses. Even the manufacturers of the electronics experience ESD failures in their factories. Electronic devices are sensitive to ESD. ESD results in failure of our computers, calculators, and car phones. There are ways to protect these sensitive components. This paper looks err ESD protection from a two-pronged approach: reducing the likelihood of having an ESD event and improving the robustness of the devices themselves. The first approach focuses on reducing the amount of charge that is developed and controlling the redistribution of any charges that are developed. The second approach reviews ways to improve the circuit robustness by improving individual circuit elements and by adding additional elements for charge flow control and voltage clamping.
引用
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页码:1878 / 1900
页数:23
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