FAN-OUT WAFER-LEVEL PACKAGING ADVANCED MANUFACTURING SOLUTION FOR FAN-OUT WLP/PLP BY DFD (DIE FACE DOWN) COMPRESSION MOLD

Compression molding was developed and introduced by Towa in the early 2000s. Over the years, TOWA has continued to improve and enhance the performance and quality of compression molding and, as a result, it has been adopted for complex packaging solutions, especially those requiring low pressure or very thin molded packages. The ever-increasing demand for integration of different technologies and smaller and thinner footprint continues to march forward. These demands challenge mold compression technology to be further expanded and innovated to address even more complicated packaging requirements such as multi-die in large panel format. In parallel, quality and reliability while meeting these challenges for FOWLP in large panel are also considered in this paper. At present, FOWLP has been targeted for high-end products such as High-Performance Computing (HPC)/ Artificial Intelligence (AI) products using RDL-first / high-precision flip chip bonding process with thinning lines and increasing number of IOs. Furthermore, FO-PLP has become a low-end product target, and chip-first cost reduction is in progress. This paper will discuss the concerns & solutions created by compression molding for panelization to address its growing demand. Compression molding is also discussed as a solution to MUF (Mold Under-fill) associated with flip chip bonding due to the use of a degassing process that employs a highly airtight and high vacuum system, and the ability to dispense resin to the full molding area to suppress the XY flow of resin during molding. In addition, since the structure is such that the force of the press is directly transmitted to the resin, the range of applicable pressure is wide and it is very effective especially for low pressure molding and particularly for fragile elements and ultra-thin interposers. These characteristics are very effective in the RDL-first process by providing a redistribution layer on the carrier, and helping in the suppression of warpage.