In situ study of hydrogen silsesquioxane dissolution rate in salty and electrochemical developers

被引:8
作者
Harry, Katherine J. [1 ,2 ]
Strobel, Sebastian [1 ]
Yang, Joel K. W. [3 ]
Duan, Huigao [3 ]
Berggren, Karl K. [1 ,4 ]
机构
[1] MIT, Dept Elect Engn & Comp Sci, Cambridge, MA 02139 USA
[2] Univ Kansas, Dept Chem & Petr Engn, Lawrence, KS 66044 USA
[3] Agcy Sci Technol & Res, Inst Mat Res & Engn, Singapore 117602, Singapore
[4] Delft Univ Technol, Kavli Inst Nanosci, Delft, Netherlands
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2011年 / 29卷 / 06期
基金
美国国家科学基金会;
关键词
dissolving; electrochemistry; electron resists; microfluidics; nanolithography; organic compounds; sputter etching; thin films; RESIST;
D O I
10.1116/1.3644339
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In order to better characterize the development of the electron-beam resist hydrogen silsesquioxane (HSQ), the authors used a quartz crystal microbalance (QCM) to study its rate of dissolution in situ. The authors determined the effect of both salt concentration and applied electric potential on the development rate of HSQ. The development rates were measured by spinning HSQ directly onto a quartz crystal resonator, and then developing in a QCM microfluidic module. In order to more directly observe the effect of electric potentials on the HSQ development rate, a film of HSQ was partially cross-linked in an O-2 plasma asher and then developed in the QCM flow module with a salt-free NaOH solution. As the partially cross-linked HSQ slowly developed, electric potentials were applied and removed from the crystal allowing the observation of how the development rate increased upon the application of a positive electric potential. The increased development rate caused by both the addition of salt ions and a positive electric potential suggests that the rate may be limited by a build-up of negative charge on the HSQ. (C) 2011 American Vacuum Society. [DOI: 10.1116/1.3644339]
引用
收藏
页数:5
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