Learning from Natural Nacre: Constructing Layered Polymer Composites with High Thermal Conductivity

被引:176
作者
Pan, Guiran [1 ,2 ]
Yao, Yimin [1 ,3 ]
Zeng, Xiaoliang [1 ]
Sun, Jiajia [1 ,4 ,5 ]
Hu, Jiantao [1 ,4 ,5 ]
Sun, Rong [1 ]
Xu, Jian-Bin [6 ]
Wong, Ching-Ping [1 ,6 ,7 ]
机构
[1] Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China
[2] China Univ Petr, Dept Chem Engn, Beijing 102249, Peoples R China
[3] Univ Chinese Acad Sci, Shenzhen Coll Adv Technol, Shenzhen 518055, Peoples R China
[4] Univ Sci & Technol China, Dept Nano Sci, Suzhou 215123, Peoples R China
[5] Univ Sci & Technol China, Technol Inst, Suzhou 215123, Peoples R China
[6] Chinese Univ Hong Kong, Dept Elect Engn, Hong Kong 999077, Hong Kong, Peoples R China
[7] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
关键词
layered polymer composites; silver nanoparticles; Al2O3; platelets; thermal conductivity; natural nacre; BORON-NITRIDE NANOSHEETS; SILVER NANOPARTICLES; ARTIFICIAL NACRE; EPOXY COMPOSITES; GRAPHENE; NANOCOMPOSITES; ALUMINA; FILMS; OXIDE; FUNCTIONALIZATION;
D O I
10.1021/acsami.7b10115
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Inspired by the microstructures of naturally layered and highly oriented materials, such as natural nacre; we report a thermally conductive polymer composite that consists of epoxy resin and Al2O3 platelets deposited with silver nanoparticles (AgNPs). Owing to their unique two-dimensional structure, Al2O3 platelets are stacked together via a hot pressing technique, resulting in a brick-and-mortar structure, which is similar to the,one of natural nacre. Moreover, the AgNPs: deposited on the surfaces of the Al2O3, platelets act as bridges that link the adjacent Al2O3 platelets due to the reduced melting point of the AgNPs. As a result, the polymer composite with 50 wt % filler achieves a maximum thermal conductivity of 6.71 W m(-1) K-1. In addition, the small addition of AgNPs (0.6 wt %) minimally affects the electrical insulation of the composites. Our bioinspired approach will find uses in the design and fabrication of thermally conductive materials for thermal management in modern electronics.
引用
收藏
页码:33001 / 33010
页数:10
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