Heat Dissipating Structure Design of an Inverter with Direct-cooling IGBT Modules for EV

被引：0

作者：

Sun Wei ^{[1
]}

Liu Jun ^{[1
]}

Su Wei ^{[1
]}

Gong Xuegeng ^{[1
]}

机构：

[1] Chinese Acad Sci, Inst Elect Engn, Beijing Engn Lab Elect Drive Syst & Power Elect D, Key Lab Power Elect & Elect Drive, Beijing, Peoples R China

来源：

2014 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE AND EXPO (ITEC) ASIA-PACIFIC 2014 | 2014年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we tested the heat dissipating performance of a self-developed 2 in 1 direct cooling IGBT module and contrasted with the traditional indirect cooling module, and a simulation model for the module was verified accurate. The experiment results show that entire thermal resistance of the direct cooling module is reduced up to 33%, meanwhile the temperature field distribution is more uniform. Then we conducted the heat dissipation structure design for a high power density inverter, and got a satisfactory result using the simulation model. At last, we tested the thermal resistance of direct cooling IGBT module in the inverter.

引用

页数：4