CLOUD MANUFACTURING: DRIVERS, CURRENT STATUS, AND FUTURE TRENDS

被引:0
作者
Wu, Dazhong [1 ]
Greer, Matthew J. [1 ]
Rosen, David W. [1 ]
Schaefer, Dirk [1 ]
机构
[1] Georgia Inst Technol, GW Woodruff Sch Mech Engn, Atlanta, GA 30332 USA
来源
PROCEEDINGS OF THE ASME 8TH INTERNATIONAL MANUFACTURING SCIENCE AND ENGINEERING CONFERENCE - 2013, VOL 2 | 2013年
关键词
PARTNER SELECTION; FRAMEWORK; SYSTEM; CNC;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Cloud Manufacturing (CM) refers to a customer-centric manufacturing model that exploits on-demand access to a shared collection of diversified and distributed manufacturing resources to form temporary, reconfigurable production lines which enhance efficiency, reduce product lifecycle costs, and allow for optimal resource loading in response to variable-demand customer generated tasking. Our objective is to present the drivers, current status of research and development, and future trends of CM. We also discuss the potential short term and long term impacts of CM on various sectors.
引用
收藏
页数:10
相关论文
共 28 条
  • [1] A system for the design and manufacture of feature-based parts through the Internet
    Alvares, Alberto J.
    Ferreira, Joao Carlos Espindola
    [J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2008, 35 (7-8) : 646 - 664
  • [2] [Anonymous], DISCR MAN CLOUD COMP
  • [3] [Anonymous], 2008, Wikinomics: How Mass Collaboration Changes Everything
  • [4] [Anonymous], 1978, EQUITY THEORY RES
  • [5] [Anonymous], P ASME 2012 INT DES
  • [6] [Anonymous], GAME THEORY INTRO AP
  • [7] An intelligent supplier management tool for benchmarking suppliers in outsource manufacturing
    Choy, KL
    Lee, WB
    Lo, V
    [J]. EXPERT SYSTEMS WITH APPLICATIONS, 2002, 22 (03) : 213 - 224
  • [8] A knowledge-based supplier intelligence retrieval system for outsource manufacturing
    Choy, KL
    Lee, WB
    Lau, HCW
    Choy, LC
    [J]. KNOWLEDGE-BASED SYSTEMS, 2005, 18 (01) : 1 - 17
  • [9] Friedman ThomasL., 2005, NEW YORK TIMES MAGAZ, P33
  • [10] Hao Q, 2005, COMPUT IND, V56, P71, DOI [10.1016/j.compind.2004.08.010, 10.1016/j.compined.2004.08.010]