Optical measurement of COP defects on silicon wafer surface by laser scattered defect pattern

被引:0
作者
Takahashi, S [1 ]
Miyoshi, T [1 ]
Takaya, Y [1 ]
Shirai, K [1 ]
机构
[1] Osaka Univ, Dept Mech Engn & Syst, Suita, Osaka 5650871, Japan
来源
PROCEEDINGS OF THE FOURTEENTH ANNUAL MEETING OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING | 1999年
关键词
laser applied measurement; surface inspection; silicon wafer; surface defects; COP;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents new optical measurement method for evaluating the defects on a silicon wafer surface quantitatively by detecting the intensity distribution, " laser scattered defect pattern ( LSDP )(1))", corresponding to the superposition of scattered light from a defect and reflected light from a surface. In order to verify a feasibility to detect "crystal originated particles ( COPs )(2))" and to discriminate them from particulate contaminations, the basic experiments were carried out for the silicon wafer surface with COPs identified by making the use of Atomic Force Microscope (AFM). Then, it was found that COPs with the size of sub-micro meter scale were able to be detected as LSDPs and suggested that our proposed method had a feasibility of discrimination between COPs and particulate contaminations by measuring the contrast of LSDP.
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页码:344 / 347
页数:4
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