Elastic Memory Composites (EMC) for deployable industrial and commercial applications

被引：34

作者：

Arzberger, SC ^{[1
]}

Tupper, ML ^{[1
]}

Lake, MS ^{[1
]}

Barrett, R ^{[1
]}

Mallick, K ^{[1
]}

Hazelton, C ^{[1
]}

Francis, W ^{[1
]}

Keller, PN ^{[1
]}

Campbell, D ^{[1
]}

Feucht, S ^{[1
]}

Codell, D ^{[1
]}

Wintergerst, J ^{[1
]}

Adams, L ^{[1
]}

Mallioux, J ^{[1
]}

Denis, R ^{[1
]}

White, K ^{[1
]}

Long, M ^{[1
]}

Munshi, NA ^{[1
]}

Gall, K ^{[1
]}

机构：

[1] CTD Inc, Lafayette, CO 80026 USA

来源：

Smart Structures and Materials 2005: Industrial and Commercial Applications of Smart Structures Technologies | 2005年 / 5762卷

关键词：

Elastic Memory Composite (EMC); shape memory polymer; composite; thermoset; epoxy; cyanate ester; deployable; smart materials; multifunctional components; commercial uses;

D O I：

10.1117/12.600583

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

The use of smart materials and multifunctional components has the potential to provide enhanced performance, improved economics, and reduced safety concerns for applications ranging from outer space to subterranean. Elastic Memory Composite (EMC) materials, based on shape memory polymers and used to produce multifunctional components and structures, are being developed and qualified for commercial use as deployable components and structures. EMC materials are sin-filar to traditional fiber-reinforced composites except for the use of a thermoset shape memory resin that enables much higher packaging strains than traditional composites without damage to the fibers or the resin. This unique capability is being exploited in the development of very efficient EMC structural components for deployable spacecraft systems as well as capability enhancing components for use in other industries. The present paper is intended primarily to describe the transition of EMC materials as smart structure technologies into viable industrial and commercial products. Specifically, the paper discusses: 1) TEMBO (R) EMC materials for deployable space/aerospace systems, 2) TEMBO (R) EMC resins for terrestrial applications, 3) future generation EMC materials.

引用

页码：35 / 47

页数：13

共 24 条

[1] Shape memory mechanics of an elastic memory composite resin [J].