共 50 条
- [1] Carbon nanotube bumps for LSI interconnect 58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 1390 - +
- [2] Carbon nanotube vias for future LSI interconnects PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2004, : 251 - 253
- [3] Carbon nanotube technologies for LSI via interconnects IEICE TRANSACTIONS ON ELECTRONICS, 2006, E89C (11): : 1499 - 1503
- [4] Interconnect length distribution for memory - Logic mixed LSI ADVANCED METALLIZATION CONFERENCE 2001 (AMC 2001), 2001, : 103 - 107
- [5] Carbon nanotube via technologies for future LSI interconnects MATERIALS FOR INFORMATION TECHNOLOGY: DEVICES, INTERCONNECTS AND PACKAGING, 2005, : 315 - 326
- [8] Carbon nanotube transistors and logic circuits Avouris, Ph. (avouris@us.ibm.com), 1600, (Elsevier):