Synthesis of 4,4′-bis (4-oxyphenoxy)benzophenone diglycidyl ether and the thermal stability for blends with 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate

We synthesized novel aromatic epoxy, 4,4'-bis(4-oxyphenoxy)benzophenone diglycidyl ether (DGEEK), by a three step reaction sequence and then it was blended with 3,4-epoxycyclohexylmetltyl 3,4-epoxycyclohexanecarboxylate (CAE). The DGEEK structure was confirmed by FT-IR and H-1-NMR measurement. Also, we investigated thermal properties of DGEEK/CAE blend epoxy by differential scanning calorimeter (DSC) and thermogravimetry analyzer (TGA). The glass transition temperature increased but initial decomposition temperature of cured epoxy decreased through the increasing amounts of ether-ether-ketone group of the epoxy network structure. By increasing the DGEEK mole fraction in the DGEEK/CAE blend epoxy matrix, the curing peak temperature decreased and the curt. ng activation energy for DGEEK/CAE blend epoxy systems showed a considerable decrease. Copyright (C) 2001 John Wiley & Sons, Ltd.