Effect of silicone vapor and humidity on contact reliability of micro relay contacts

被引:24
作者
Tamai, T
机构
[1] Hyogo University of Teacher Education, Electronics Institute, Kato-gun, Hyogo 673-14, 942-1 Shimokume, Yashiro-cho
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1996年 / 19卷 / 03期
关键词
silicone; micro relay; silicone contamination; contact failure; contact resistance; discharge;
D O I
10.1109/95.536834
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Contact resistance characteristics of a micro relay with Au(90 wt%)-Ag(10 wt%) cladded contacts were examined in air containing silicone vapor and in air mixed with the silicone vapor and high humidity. Electrical conditions for resistive loads of the contacts were covered with four regions such as bridge region, the first micro-arc region, the second micro-arc region, and arc region. Concentrations of the silicone vapor were selected: 1300 ppm which gives saturation of the vapor and 7 ppm which is the safety level for the contact reliability. Moreover, the effect of humidity on dynamic contact resistance characteristics in the silicone environment was also studied. As a result, a boundary of occurrence of contact failure in a relationship between voltage and current was found. This boundary was given by a certain electrical power. The number of operations to failure was found to be inversely proportional to electric power. Under condition of high humidity, low contact resistance maintained longer operation time than low humidity.
引用
收藏
页码:329 / 338
页数:10
相关论文
共 12 条
[1]  
ESKES A, 1987, P IEEE HOLM C EL CON, P187
[2]  
HOLM R, 1958, ELECTRIC CONTACTS
[3]  
HOPKINS MR, 1972, P HOLM SEM EL CONT P, P401
[4]  
Ibach H., 1977, Electron spectroscopy for surface analysis
[5]  
JONES LF, 1957, PHYSICS ELECT CONTAC
[6]   SILICONE OILS ON ELECTRICAL CONTACTS - EFFECTS, SOURCES, AND COUNTERMEASURES [J].
KITCHEN, NM ;
RUSSELL, CA .
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1976, 12 (01) :24-28
[7]  
Mitani S, 1977, P HOLM SEM EL CONT P, P207
[8]   FORMATION OF SIO2 ON CONTACT SURFACE AND ITS EFFECT ON CONTACT RELIABILITY [J].
TAMAI, T .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (04) :437-441
[9]  
TAMAI T, 1993, P IEEE HOLM C EL CON, P269
[10]  
Witter G. J., 1979, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, VCHMT-2, P56, DOI 10.1109/TCHMT.1979.1135411